Technical Parameter
Card Type
Non Specified - Dual Edge, Bi-Level
Number of Positions/Bay/Row
64
Card Thickness
0.062" (1.57mm)
Features
Bi-Level - High Density
Mounting Type
Through Hole, Right Angle
Contact Material
Beryllium Copper
Contact Finish Thickness
30.0?in (0.76?m)
Flange Feature
Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia